什么(me)叫(jiao)嵌入式處理(li)器(qi)?大牛(niu)一點就通
時間：2018-07-23 來源：未知
嵌(qian)入式(shi)發展(zhan)如(ru)此(ci)的(de)(de)快，很(hen)多(duo)產品已經(jing)廣(guang)泛的(de)(de)應用(yong)在我們生活中了，對(dui)于嵌(qian)入式(shi)系(xi)統的(de)(de)核心嵌(qian)入式(shi)處(chu)理器(qi)來說，有(you)很(hen)多(duo)人在接觸這一塊(kuai)的(de)(de)時候，對(dui)嵌(qian)入式(shi)處(chu)理器(qi)很(hen)不了解，學習嵌(qian)入式(shi)系(xi)統，這個(ge)嵌(qian)入式(shi)處(chu)理器(qi)還真(zhen)是(shi)不能少的(de)(de)，那就(jiu)來看(kan)看(kan)業界大牛是(shi)如(ru)何解釋嵌(qian)入式(shi)處(chu)理器(qi)的(de)(de)。
首(shou)先開門見山，嵌(qian)(qian)入式(shi)處理(li)器(qi)是(shi)嵌(qian)(qian)入式(shi)系(xi)(xi)統的核心，是(shi)控(kong)制、輔助系(xi)(xi)統運行的硬件單元。根據其現狀，嵌(qian)(qian)入式(shi)處理(li)器(qi)可(ke)以分為(wei)嵌(qian)(qian)入式(shi)微處理(li)器(qi)、嵌(qian)(qian)入式(shi)微控(kong)制器(qi)、嵌(qian)(qian)入式(shi)DSP處理(li)器(qi)和嵌(qian)(qian)入式(shi)片上系(xi)(xi)統。
那么就一個一個來了解一下(xia)
1.嵌入式微處理器(qi)
嵌(qian)入(ru)(ru)(ru)式(shi)(shi)(shi)微(wei)(wei)處(chu)(chu)理(li)器(qi)(qi)(qi)是(shi)(shi)具(ju)(ju)有32位以上的(de)處(chu)(chu)理(li)器(qi)(qi)(qi)，具(ju)(ju)有較(jiao)高的(de)性(xing)能(neng)。與計(ji)算(suan)機不(bu)相同(tong)的(de)是(shi)(shi)再實(shi)際嵌(qian)入(ru)(ru)(ru)式(shi)(shi)(shi)應用中(zhong)，只保留(liu)和(he)嵌(qian)入(ru)(ru)(ru)式(shi)(shi)(shi)應用緊密相關的(de)功能(neng)硬件(jian)(jian)。 和(he)工業(ye)控(kong)制(zhi)計(ji)算(suan)機相比，嵌(qian)入(ru)(ru)(ru)式(shi)(shi)(shi)微(wei)(wei)處(chu)(chu)理(li)器(qi)(qi)(qi)具(ju)(ju)有體積小、重量輕、成本低、可靠性(xing)高的(de)優點，但是(shi)(shi)在(zai)(zai)電路板(ban)上必須包括ROM、RAM、總線接(jie)口(kou)、各種外設(she)等(deng)(deng)器(qi)(qi)(qi)件(jian)(jian)，從而降(jiang)低了(le)系統的(de)可靠性(xing)，技術保密性(xing)也較(jiao)差。嵌(qian)入(ru)(ru)(ru)式(shi)(shi)(shi)微(wei)(wei)處(chu)(chu)理(li)器(qi)(qi)(qi)及其存儲器(qi)(qi)(qi)、總線、外設(she)等(deng)(deng)安(an)裝在(zai)(zai)1塊電路板(ban)上，稱為單板(ban)計(ji)算(suan)機，如STD-BUS、PC104等(deng)(deng)。近年來(lai)，德國、日本的(de)一些公(gong)司又(you)開(kai)發(fa)出了(le)“火柴(chai)盒”式(shi)(shi)(shi)名片大小的(de)嵌(qian)入(ru)(ru)(ru)式(shi)(shi)(shi)計(ji)算(suan)機系列(lie)OEM產(chan)品(pin)。嵌(qian)入(ru)(ru)(ru)式(shi)(shi)(shi)微(wei)(wei)處(chu)(chu)理(li)器(qi)(qi)(qi)目(mu)前主要有Am186/88、386EX、SC400、Power PC、68000、MIPS、ARM系列(lie)等(deng)(deng)。
2.嵌入式DSP處理器
DSP處(chu)(chu)理(li)(li)(li)(li)器(qi)對系(xi)統結(jie)構(gou)和指令(ling)進行了特殊(shu)設計，使其適合于(yu)執(zhi)行DSP算(suan)法(fa)，編譯效率較高(gao)，指令(ling)執(zhi)行速度(du)也(ye)較高(gao)。在(zai)數字(zi)濾(lv)波、FFT、譜分析等方(fang)面，DSP算(suan)法(fa)正在(zai)大量(liang)進入嵌(qian)(qian)(qian)入式(shi)(shi)領域。DSP應用正在(zai)從(cong)通(tong)用單(dan)片(pian)機中(zhong)以普通(tong)指令(ling)實現DSP功能(neng)，過渡到采用嵌(qian)(qian)(qian)入式(shi)(shi)DSP處(chu)(chu)理(li)(li)(li)(li)器(qi)。嵌(qian)(qian)(qian)入式(shi)(shi)DSP處(chu)(chu)理(li)(li)(li)(li)器(qi)有(you)2個發展來(lai)源：一(yi)(yi)是DSP處(chu)(chu)理(li)(li)(li)(li)器(qi)經過單(dan)片(pian)化(hua)(hua)、EMC改造、增加片(pian)上外設，成為嵌(qian)(qian)(qian)入式(shi)(shi)DSP處(chu)(chu)理(li)(li)(li)(li)器(qi)，TI公(gong)(gong)司(si)的(de)TMS320C2000/C5000等屬于(yu)此范疇;二是在(zai)通(tong)用單(dan)片(pian)機或(huo)SoC中(zhong)增加I)SP協處(chu)(chu)理(li)(li)(li)(li)器(qi)，例如Intel公(gong)(gong)司(si)的(de)MCS-296和Siemens公(gong)(gong)司(si)的(de)TriCore。推動嵌(qian)(qian)(qian)入式(shi)(shi)DSP處(chu)(chu)理(li)(li)(li)(li)器(qi)發展的(de)另一(yi)(yi)個因素是嵌(qian)(qian)(qian)入式(shi)(shi)系(xi)統的(de)智(zhi)能(neng)化(hua)(hua)，例如各種(zhong)帶有(you)智(zhi)能(neng)邏輯的(de)消費(fei)類(lei)(lei)產品(pin)、生物信息識別(bie)終端、帶有(you)加解密算(suan)法(fa)的(de)鍵(jian)盤(pan)、ADSL接入、實時語音壓解系(xi)統、虛(xu)擬現實顯(xian)示(shi)等。這類(lei)(lei)智(zhi)能(neng)化(hua)(hua)算(suan)法(fa)一(yi)(yi)般都運(yun)算(suan)量(liang)較大，特別(bie)是向量(liang)運(yun)算(suan)、指針線性尋址等較多，而這些正是DSP處(chu)(chu)理(li)(li)(li)(li)器(qi)的(de)長處(chu)(chu)所在(zai)。
3.嵌(qian)入(ru)式(shi)微控(kong)制器
嵌入(ru)式(shi)(shi)(shi)微(wei)(wei)(wei)(wei)控(kong)制器(qi)(qi)的(de)(de)(de)(de)(de)典型代表是(shi)(shi)單片(pian)(pian)機(ji)。嵌入(ru)式(shi)(shi)(shi)微(wei)(wei)(wei)(wei)控(kong)制器(qi)(qi)一(yi)(yi)般(ban)以(yi)某一(yi)(yi)種(zhong)微(wei)(wei)(wei)(wei)處(chu)理器(qi)(qi)內核為核心，芯片(pian)(pian)內部集成(cheng)(cheng)Flash, RAM, EEPROM, 總(zong)(zong)線，總(zong)(zong)線邏輯， 定時(shi)器(qi)(qi)/計(ji)數器(qi)(qi)串行口等(deng)各種(zhong)必要(yao)的(de)(de)(de)(de)(de)功(gong)(gong)能模塊。為適應(ying)(ying)不同的(de)(de)(de)(de)(de)應(ying)(ying)用(yong)需(xu)求(qiu)，一(yi)(yi)般(ban)一(yi)(yi)個系列的(de)(de)(de)(de)(de)單片(pian)(pian)機(ji)具有多(duo)種(zhong)衍生產品，每種(zhong)衍生產品的(de)(de)(de)(de)(de)處(chu)理器(qi)(qi)內核都是(shi)(shi)一(yi)(yi)樣(yang)(yang)的(de)(de)(de)(de)(de)，不同的(de)(de)(de)(de)(de)是(shi)(shi)存(cun)儲器(qi)(qi)和(he)(he)外設的(de)(de)(de)(de)(de)配置及封裝。這(zhe)樣(yang)(yang)可以(yi)使單片(pian)(pian)機(ji)最大限度地和(he)(he)應(ying)(ying)用(yong)需(xu)求(qiu)相(xiang)匹配，功(gong)(gong)能不多(duo)不少，從而減少功(gong)(gong)耗(hao)和(he)(he)成(cheng)(cheng)本。和(he)(he)嵌入(ru)式(shi)(shi)(shi)微(wei)(wei)(wei)(wei)處(chu)理器(qi)(qi)相(xiang)比(bi)，微(wei)(wei)(wei)(wei)控(kong)制器(qi)(qi)的(de)(de)(de)(de)(de)最大特點是(shi)(shi)單片(pian)(pian)化——體積大大減小，從而使功(gong)(gong)耗(hao)和(he)(he)成(cheng)(cheng)本下(xia)降(jiang)，可靠性提高。微(wei)(wei)(wei)(wei)控(kong)制器(qi)(qi)是(shi)(shi)目(mu)前嵌入(ru)式(shi)(shi)(shi)系統(tong)工(gong)業的(de)(de)(de)(de)(de)主流。微(wei)(wei)(wei)(wei)控(kong)制器(qi)(qi)的(de)(de)(de)(de)(de)片(pian)(pian)上(shang)外設資源一(yi)(yi)般(ban)比(bi)較豐富，適合于(yu)控(kong)制，因此稱微(wei)(wei)(wei)(wei)控(kong)制器(qi)(qi)。
4.嵌入式片(pian)上(shang)(shang)系(xi)(xi)統(SOC) 片(pian)上(shang)(shang)系(xi)(xi)統是結(jie)合了許多功能模塊，將(jiang)整個(ge)(ge)(ge)系(xi)(xi)統坐(zuo)在一(yi)(yi)個(ge)(ge)(ge)芯片(pian)上(shang)(shang)的產品。 SOC分為通用(yong)和專用(yong)兩種。通用(yong)的包括M-Core、某些ARM系(xi)(xi)列器件。專用(yong)SOC一(yi)(yi)般專用(yong)于某個(ge)(ge)(ge)或某類(lei)系(xi)(xi)統中，不為一(yi)(yi)般用(yong)戶所(suo)知。
這(zhe)些就都是嵌(qian)入(ru)(ru)(ru)式處(chu)理器(qi)(qi)，現在(zai)你對(dui)嵌(qian)入(ru)(ru)(ru)式處(chu)理器(qi)(qi)理解了嗎?而且嵌(qian)入(ru)(ru)(ru)式處(chu)理器(qi)(qi)分為四類，每(mei)一類都有不(bu)同的(de)作用用途(tu)，你需要做的(de)就是好好理解，要理解透(tou)徹，才(cai)能掌握(wo)好嵌(qian)入(ru)(ru)(ru)式處(chu)理器(qi)(qi)。
